Provided is a copper foil for a printed circuit board comprising a heatproof treatment layer formed on an non-roughened surface of the copper foil to become a joining surface with resin, a chromate coated layer formed on the heatproof treatment layer, and a silane coupling agent layer formed on the chromate coated layer, wherein the Zn amount of the outermost copper foil surface after forming the silane coupling agent layer is 1.5 Atomic% or less, and the Cr amount is 3.0 to 12.0 Atomic%. This copper foil for a printed circuit board is superior in chemical resistance, adhesiveness, and high frequency characteristics.