The present invention provides an anodic bonding apparatus 1, 1 b for bonding a laminate including an electrically conductive substrate 3 and a glass substrate 4, the anodic bonding apparatus including: a container 2 of which pressure is capable of being reduced; an upper electrode 11 disposed in the container and configured in a movable manner in the vertical direction so as to contact to and separate from the laminate, and the upper electrode including: a main body part 13; an electrically conductive metal thin plate 12 to be contacted with the laminate; and a space part 15, between the main body part and the electrically conductive metal thin plate, into and from which a fluid is supplied and drained, wherein the electrically conductive metal thin plate has a diaphragm structure being capable of deforming based on a pressure difference between the space part and the inside of the container, the electrically conductive metal thin plate 12 is positioned at the main body part so as to swell in a convex form in the direction to the laminate when the space part is higher in pressure than the inside of the container; and a lower electrode 10, wherein the electrically conductive substrate and the glass substrate is bonded by: interposing the laminate between the upper electrode and the lower electrode; heating the laminate; and applying a direct current voltage to the laminate such that the electrically conductive substrate is an anode and the glass substrate is a cathode.