The double face polishing apparatus (30) is capable of controlling an amount of supplying slurry to a lower polishing plate (32). The double face polishing apparatus (30) comprises: the lower polishing plate (32) and an upper polishing plate (36); a carrier (44) provided between the polishing plates (32, 36), the carrier (44) having a through-hole for holding a workpiece; a plate driving unit (40, 42) for rotating the polishing plates (32, 36); a carrier driving unit (46, 48) for rotating the carrier (44); ring-shaped ducts (54, 56) coaxially provided to the upper polishing plate (36); a slurry supply source (64) supplying slurry to the ring-shaped ducts (54, 56); and supply pipes (78) for supplying the slurry to the lower polishing plate (32). The slurry is supplied to each of coaxial polishing zones of the lower polishing plate (32) via the corresponding ring-shaped ducts (54, 56) and the supply pipes (78).