Bain de placage d'alliage solide d'or
| N° de brevet: |
EP1892321 (A2) |
| Date de publication: |
2008-02-27 |
| Inventeur(s): |
ORIHASHI MASANORI [JP];TAKIZAWA YASUSHI [JP]; |
| Demandeur(s): |
ROHM &;HAAS ELECT MATERIALS [US]; |
| Classification: |
C25D3/62; |
| N° de demande: |
EP20070114509 20070817 |
| Numéro(s) de priorité: |
JP20060224465 20060821 |
A hard gold alloy plating solution and plating method which provides a gold alloy plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
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