PROCEDE ET DISPOSITIF POUR REGULER LE FONCTIONNEMENT D'UNE CHAMBRE DE COMBUSTION DE TURBINE A GAZ
| N° de brevet: |
EP1880141 (A1) |
| Date de publication: |
2008-01-23 |
| Inventeur(s): |
BAUER ANDREAS [DE];BODE SIEGFRIED [DE];DEUKER EBERHARD [DE];DIEBELS ANDREAS [DE];HAHNER THOMAS [DE];HESSE THOMAS [DE];KREBS WERNER [DE];LEPERS JOACHIM [DE];MUELLER MARTIN [DE];PERNAU STEFAN [DE];PRADE BERND [DE];SCHNEIDER PETER-ANDREAS [DE];SIMON DIETER [DE];STURM BERTHOLD [DE];THOELKING HEINRICH [DE];WARNACK DIETER [DE]; |
| Demandeur(s): |
SIEMENS AG [DE]; |
| Classification: |
F23N1/02;F23N5/00;F23N5/02;F23N5/16;F23R3/34;F02C9/50;F23R3/26; |
| N° de demande: |
EP20060755118 20060510 |
| Numéro(s) de priorité: |
WO2006EP62183 20060510;EP20050010543 20050513;EP20060755118 20060510 |
A metallic copper and resin composite body manufacturing method of forming a copper wiring layer that forms an inner layer circuit, establishing an insulating layer with a resin on said wiring layer, forming via holes which expose the copper surface under the insulative layer, and depositing a metal on the copper surface that is exposed at the bottom of the via holes. The method includes a step of: removing copper oxide which forms on the surface of the copper that is exposed in the bottom of the via holes using a phosphoric acid aqueous solution with a pH between 1 and 3. The method suppresses haloing is and via holes with excellent solder bonding are formed.
| 
