A method of packaging an electronic component, which is capable of enhancing electrical and mechanical bonding reliability of the electronic component. Terminal (4) is provided on the side face of electronic component (1). Electrode (6) is formed on one or the other major surface of substrate (5) and terminal (4) provided in electronic component (1) is located on electrode (6). Solder paste produced by mixing solder particles with thermosetting flux is applied to electrode (6), terminal (4) of electronic component (1) is mounted on and brought into contact with the applied solder paste, and electronic component (1) is mounted on substrate (5) with clearance (S) provided between a part of electronic component (1) and opposing substrate (5). Solder bonding structure (8) for coupling terminal (4) and electrode (6) is formed by reflow. Solder bonding structure (8) includes solder bonding portion (8a), resin reinforcing portion (8b) and resin adhering portion (8c). Resin reinforcing portion (8b) reinforces solder bonding portion (8a), and resin adhering portion (8c) fixes electronic component (1) to substrate (5) when the resin entering clearance (S) between electronic component (1) and substrate (5) is solidified.