The method involves laminating a conductive layer (5) on a substrate, where the substrate comprises a heat dissipating metallic plate (1) and a printed circuit board (2). The lamination of the conductive layer is carried out on the substrate`s side that does not comprise a copped side (3) of the printed circuit board. The metallic plate is drilled and the board is embedded in the plate, where the dimensions of the circuit board correspond to a recess drilled in the metallic plate.