Disclosed is a photosensitive, low dielectric polyimide that is applied to uses such as interlayer insulation films of semiconductor devices, for which low dielectric constant is required. The polyimide according to the present invention shows positive-type photosensitivity, is soluble in a solvent, is formed by polycondensation between one or more aromatic tetracarboxylic dianhydrides and mainly one or more aromatic diamines, wherein at least one of the one or more aromatic tetracarboxylic dianhydrides and the one or more diamines contain (a) fluorine atom(s), and/or the diamine(s) is(are) benzidine or (a) derivative(s) thereof and/or (a) fluorene derivative(s), and has a relative dielectric constant of not more than 2.90.