Résumé dans la langue de publication The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 um, and comprised of rough particles and fine particles.